Cov ntaub ntawv nyias nyias yog cog rau ntawm qhov chaw ntawm cov khoom siv substrate (xws li cov iav iav thiab cov iav kho qhov muag) thiab feem ntau yog tsim los ntawm cov ntaub ntawv txheej xws li hlau, tsis yog -hlau, alloys, lossis cov tebchaw. Lawv muaj ntau yam khoom, suav nrog kev tiv thaiv -xav, nqus, txiav, spectral dispersion, kev xav thiab lim, cuam tshuam, kev tiv thaiv, tiv thaiv dej thiab stain, antistatic zog, conductivity, sib nqus permeability, rwb thaiv tsev, hnav tsis kam, kub tsis kam, corrosion kuj, oxidation kuj, hluav taws xob tiv thaiv, kho kom zoo nkauj, thiab kev ua haujlwm zoo. Lawv tuaj yeem txhim kho cov khoom zoo, ua tiav kev tiv thaiv ib puag ncig thiab kev txuag hluav taws xob, txuas ntxiv cov khoom lag luam, thiab txhim kho kev ua haujlwm qub. Currently, the mainstream thin film material preparation technologies mainly include two major systems:
Lub cev vapor deposition (PVD)thiab tshuaj vapor deposition (CVD).
1. Sputtering Txheej Technology Cov cuab yeej no tsim cov ions siv qhov chaw ion, ua kom nrawm thiab sib sau ua ke hauv lub tshuab nqus tsev kom tsim tau lub siab -ceev ion beam uas ua rau cov khoom tawg. Cov ions pauv kinetic zog nrog cov atoms ntawm cov khoom nto, ua rau cov khoom atoms tshem tawm ntawm lub substrate thiab tso rau ntawm lub substrate nto. Lub foob pob tawg, siv los ua cov khoom siv raw rau tso cov yeeb yaj kiab nyias, hu ua lub hom phiaj sputtering. Lub hom phiaj tsuas yog muaj lub hom phiaj dawb paug thiab lub nraub qaum (rov qab raj): lub hom phiaj dawb paug, raws li cov tub ntxhais tivthaiv foob pob los ntawm ion beam, muaj nws cov atoms nto sputtered thiab tso rau hauv zaj duab xis; lub backplate muab fixation thiab kev txhawb nqa, thiab kuj muaj cov hluav taws xob zoo heev thiab thermal conductivity. Cov thev naus laus zis no muaj qhov zoo xws li cov yeeb yaj kiab zoo sib xws, tswj tau tuab, thiab rov ua tau zoo dua. The prepared films have high purity, strong density, and excellent adhesion, making it one of the mainstream technologies for thin film preparation and driving the continuous growth in demand for high-value-added sputtering targets.
2. Vacuum Evaporation Txheej Technology Cov cuab yeej no siv cov khoom siv cua sov hauv qhov chaw nqus tsev uas siv cov evaporation los vaporize nws, uas tom qab ntawd tso rau ntawm qhov chaw substrate los ua ib zaj duab xis nyias. Cov khoom siv evaporated yog hu ua cov khoom siv evaporation, thiab lub kaw lus muaj peb lub ntsiab lus: lub tshuab nqus tsev, qhov chaw evaporation, thiab lub substrate los ua ke. Lub evaporation qhov chaw yuav tsum tuav cov khoom evaporation thiab muab cua sov txaus kom ua tiav qhov xav tau vapor siab. Lub tshuab no yog tus cwj pwm los ntawm nws txoj haujlwm yooj yim thiab tsim cov yeeb yaj kiab sai, thiab feem ntau yog tsim rau txheej me me - cov ntaub ntawv substrate.
Ob hom PVD thev naus laus zis no ua ke tsim cov txheej txheem thev naus laus zis rau kev npaj ua haujlwm niaj hnub nyias nyias. Los ntawm kev sib sib zog nqus ntawm cov ntaub ntawv kev tshawb fawb thiab lub tshuab nqus tsev, lawv txuas ntxiv tsav kev tsim kho thev naus laus zis hauv kev txiav- ntug teb xws li optoelectronics, lub zog tshiab, thiab semiconductors.
