Nyob rau hauv kev cuam tshuam ntawm kev sib nrig sib txuas ntawm electromagnetic teb, electrons txav mus rau hauv cycloidal yam thiab raug khi rau lub hom phiaj saum npoo, uas ua rau lawv txoj kev mus rau hauv cov ntshav plasma thiab nce lawv txoj kev koom tes hauv kev sib tsoo thiab ionization txheej txheem ntawm cov roj molecules, ionizing ntau ions thiab txhim kho tus nqi ionization ntawm cov pa. Tshem tawm tuaj yeem khaws cia txawm tias nyob rau hauv qis dua roj. Yog li ntawd, magnetron sputtering tsis tsuas yog txo cov roj siab thaum lub sij hawm sputtering txheej txheem, tab sis kuj txhim kho cov sputtering efficiency thiab deposition tus nqi.
Txawm li cas los xij, sib npaug magnetron sputtering kuj muaj nws qhov tsis zoo. Piv txwv li, vim lub magnetic teb, electrons generated los ntawm glow tawm thiab sputtered thib ob electrons yog nruj nreem kaw nyob rau hauv ib ncig ntawm lub hom phiaj nto los ntawm parallel magnetic teb. Lub plasma cheeb tsam yog ruaj khov rau thaj tsam ntawm kwv yees li 60 hli ntawm lub hom phiaj nto. Raws li qhov kev ncua deb ntawm lub hom phiaj nto nce, lub plasma concentration txo sai heev. Nyob rau ntawm lub sijhawm no, lub workpiece tsuas yog muab tso rau hauv thaj tsam ntawm 50-100 hli ntawm lub hom phiaj magnetron kom txhim kho cov nyhuv ntawm ion bombardment.
Qhov luv luv txheej txheej no txwv qhov ntev geometric ntawm lub workpiece yuav tsum tau coated, ua rau nws tsis haum rau loj workpieces los yog cub tawg loads, yog li txwv tsis pub siv magnetron sputtering technology. Tsis tas li ntawd, thaum lub sij hawm sib npaug magnetron sputtering, lub ejected lub hom phiaj hais muaj qis zog, ua rau cov zaj duab xis tsis zoo - substrate bonding zog. Tsawg- lub zog tso tawm atoms muaj kev txav mus los ntawm cov substrate nto, yooj yim tsim ntxeem tau, ntxhib, columnar nyias zaj duab xis. Thaum nce qhov kub ntawm lub workpiece tuaj yeem txhim kho cov qauv thiab cov khoom ntawm cov yeeb yaj kiab, ntau zaus, cov khoom siv ua haujlwm nws tus kheej tsis tuaj yeem tiv taus qhov kub siab.
Qhov tshwm sim ntawm qhov tsis sib xws ntawm magnetron sputtering ib nrab overcomes cov saum toj no - hais txog shortcomings. Nws coj cov ntshav los ntawm lub hom phiaj cathode mus rau thaj tsam ntawm 200-300 mm nyob rau hauv pem hauv ntej ntawm lub hom phiaj sputtering, immersing lub substrate nyob rau hauv lub plasma, raws li qhia nyob rau hauv daim duab. Nyob rau hauv txoj kev no, ntawm ib sab, sputtered atoms thiab hais tso rau ntawm substrate nto los ua ib tug nyias zaj duab xis; Ntawm qhov tod tes, lub plasma bombards lub substrate nrog ib tug tej lub zog, ua raws li ib tug ion beam - pab deposition tus neeg saib xyuas, zoo heev txhim kho cov yeeb yaj duab zoo.
Tsis sib npaugmagnetron sputtering systemsmuaj ob tug qauv. Ib hom muaj lub zog sib nqus ntau dua hauv cov tub ntxhais hauv lub nplhaib sab nraud, thiab cov kab hlau nplaum tsis raug kaw, raug kos rau ntawm phab ntsa nqus tsev vacuum, uas ua rau cov ntshav tsis tshua muaj nyob rau ntawm qhov chaw substrate. Yog li ntawd, txoj kev no tsis tshua siv. Lwm txoj hauv kev suav nrog lub nplhaib sab nraud sib nqus lub zog siab dua li cov tub ntxhais sib nqus lub zog. Cov kab hluav taws xob sib nqus tsis tsim lub voj kaw tag nrho, nrog qee lub nplhaib sab nraud cov kab hlau nplaum txuas mus rau lub substrate nto. Qhov no tso cai rau qee qhov thib ob electrons khiav tawm ntawm lub hom phiaj ntawm thaj av raws li cov kab sib nqus thiab sib tsoo nrog cov khoom nruab nrab, ionizing lawv.
Lub plasma tsis yog kiag li nyob rau hauv lub hom phiaj ntawm thaj av ntawd tab sis tuaj yeem ncav cuag lub substrate nto, ntxiv kom cov ion concentration nyob rau hauv lub deposition cheeb tsam thiab tsa lub substrate ion tam sim no ceev, feem ntau ncav cuag siab tshaj 5 mA / cm². Nyob rau hauv txoj kev no, qhov chaw sputtering kuj ua raws li qhov chaw ion bombarding lub substrate nto. Lub substrate ion beam tam sim no ceev yog proportional rau lub hom phiaj tam sim no ceev. Kev nce lub hom phiaj tam sim no ceev ua rau muaj kev tso nyiaj ntau dua, thaum lub sij hawm nce substrate ion beam tam sim no ceev muab ib qho kev foob pob tawg rau ntawm cov yeeb yaj kiab deposited.
Tsis sib npaug magnetron sputtering ion bombardment tuaj yeem ntxuav cov oxide txheej thiab lwm yam impurities ntawm lub workpiece ua ntej txheej, qhib lub workpiece nto, thiab tsim ib tug pseudo - diffusion txheej ntawm lub workpiece nto, uas yuav pab txhim kho cov adhesion ntawm zaj duab xis thiab workpiece nto. Thaum lub sij hawm txheej txheej txheej, lub foob pob hluav taws ntawm cov khoom siv hluav taws xob tuaj yeem ua tiav lub hom phiaj ntawm kev hloov kho cov yeeb yaj kiab. Piv txwv li, ion bombardment nyiam tev tawm cov khoom sib txuas thiab cov khoom tawm los ntawm zaj duab xis, cuam tshuam qhov kev loj hlob tseem ceeb ntawm crystalline los yog condensed lub xeev ntawm zaj duab xis, yog li ua ib tug denser, ntau uniform, thiab ntau uniform films, thiab muaj peev xwm tso siab heev - coatings kev ua tau zoo ntawm qis kub.
Daim ntawv thov ntawm unbalanced magnetron sputtering nqus deposition tshuab tau daws qhov teeb meem ntawm depositing ntom thiab complex films ntsib nyob rau hauv balanced magnetron sputtering. Txawm li cas los xij, nws yog qhov nyuaj rau tso cov yeeb yaj kiab tsis sib xws ntawm cov txheej txheem nyuaj uas siv ib lub hom phiaj magnetron tsis sib npaug. Ntxiv mus, raws li electrons ya mus rau lub substrate, ib co electrons yog adsorbed mus rau lub nqus tsev vacuum phab ntsa raws li lub magnetic teb lub zog tsis muaj zog, ua rau ib tug txo nyob rau hauv electron thiab ion concentrations. Txhawm rau hais txog qhov no, cov kws tshawb fawb tau tsim ntau- lub hom phiaj tsis sib npaug magnetron sputtering systems kom kov yeej qhov tsis txaus ntawm ib qho -lub hom phiaj tsis sib npaug magnetron sputtering. Multi-target unbalanced magnetron sputtering systems yuav muab faib mus rau hauv kaw magnetic teb unbalanced magnetron sputtering nrog sib nqus ncej nyob ib sab mus rau ib leeg thiab daim iav magnetic teb unbalanced magnetron sputtering nrog sib nqus ncej zoo tib yam rau ib leeg, raws li qhia nyob rau hauv daim duab rau dual-magnetic teb} lub hom phiaj kaw {8} magnetic teb.
Muab piv rau qhov sib nqus ntawm qhov sib nqus ntawm qhov kaw- teb tsis yog- sib npaug lub hom phiaj khub thiab daim iav lub hom phiaj, nws tuaj yeem pom tau tias qhov sib txawv ntawm qhov sib nqus tsis tseem ceeb nyob ze ntawm lub hom phiaj. Lub transverse magnetic teb ntawm sab hauv thiab sab nraud magnetic ncej confines electrons, tsim ib tug heev ionized plasma cathode cheeb tsam. Nyob rau hauv cheeb tsam no, zoo ions muaj zog sputter thiab etch lub hom phiaj nto, sputtering tawm ib tug loj tus naj npawb ntawm cov hom phiaj uas ya mus rau lub substrate nto. Nyob rau sab hauv thiab sab nraud lub nplhaib hlau nplaum, tshwj xeeb tshaj yog nyob rau ntawm lub nplhaib sab nraud muaj zog hlau nplaum, qhov ntev ntawm cov hlau nplaum sib nqus dominates, dhau los ua cov channel tseem ceeb rau cov electrons thib ob kom khiav tawm ntawm lub hom phiaj.
Qhov no dhau los ua cov channel tseem ceeb rau kev thauj cov khoom them nqi mus rau thaj tsam txheej. Sib piv qhov sib nqus ntawm qhov sib nqus ntawm qhov chaw sib nqus kaw thiab daim iav sib nqus hauv thaj tsam txheej qhia qhov sib txawv tseem ceeb. Rau daim iav phiaj khub, vim yog kev sib nrig sib sib nqus ntawm ob lub hom phiaj sib nqus, qhov ntev ntawm cov hlau nplaum sib nqus raug yuam kom khoov tawm sab nraud los ntawm cov txheej txheej (lub tshuab nqus tsev phab ntsa), ua rau cov electrons coj mus rau lub tshuab nqus tsev phab ntsa thiab poob, yog li txo tag nrho cov electrons thiab tom qab ions.
Vim tias daim iav magnetic teb txoj kev tsis tuaj yeem txwv cov electrons zoo, cov plasma sputtering efficiency tsis zoo tuaj. Nyob rau hauv sib piv, lub longitudinal magnetic teb ntawm ib tug kaw magnetic teb uas tsis yog -equilibrium phiaj khub kaw nyob rau hauv lub txheej txheej. Ntev npaum li qhov sib nqus lub zog txaus, cov khoom siv hluav taws xob tsuas yog txav mus los ntawm thaj chaw txheej thiab ob lub hom phiaj, tsis txhob poob hluav taws xob thiab yog li ua kom cov ion concentration hauv thaj chaw txheej txheej, ua kom muaj txiaj ntsig zoo ntawm sputtering.
