Rov qab Sputtering Parameters: Ntawm Qhov Bias Voltage Puas Yog Zaj Duab Xis Deposited Re-sputtered Tawm?
Puas yog cov yeeb yaj kiab uas twb tau tso lawm yuav raug kaw thaum qhov kev tsis sib haum xeeb siab?
Cov lus teb yog yog.
Qhov tshwm sim no hu ua reverse sputtering (los yog re-sputtering) hauv PVD.
Thaum qhov kev tsis ncaj ncees voltage tshaj qhov tseem ceeb, lub zog ion ua rau siab txaus kom tshem tawm cov yeeb yaj kiab atoms twb tso thiab eject lawv rov qab mus rau theem roj. Tus nqi deposition poob raws li. Hauv qhov xwm txheej hnyav, qhov kev tso tawm tsis zoo tshwm sim - zaj duab xis loj hlob zuj zus nyob rau lub sijhawm.
Reverse Sputtering yog dab tsi?
Thaum lub sij hawm PVD deposition, ob txheej txheem ib txhij coj qhov chaw ntawm lub workpiece nto:
Kev loj hlob ntawm zaj duab xis: Atoms sputtered los ntawm lub hom phiaj mus rau lub substrate thiab tsim cov txheej.
Zaj duab xis etching: Ions nrawm los ntawm kev tsis ncaj ncees foob pob ua haujlwm thiab khob tawm cov atoms uas twb tso lawm.
Yog li ntawd, tus nqi deposition raws li qhov kev sib raug zoo no:
Net Deposition Rate=Deposition Rate − Re-sputtering Rate
Raws li kev ua haujlwm ib txwm muaj, tus nqi tso nyiaj ntau tshaj qhov re-sputtering tus nqi, yog li cov yeeb yaj kiab thickness nce. Raws li kev tsis ncaj ncees voltage nce, re-sputtering intensifies. Thaum kawg, tus nqi ntawm cov atoms raug tshem tawm tuaj yeem tshaj tus nqi deposition.
Cia peb ua ntej qhia lub ntsiab lus tseem ceeb: sputtering yield.
Sputtering yield yog hais txog qhov nruab nrab ntawm cov atoms ejected thaum ib qho siab -zog ion ntaus ib yam khoom. Piv txwv li, thaum 500 eV argon ions bombard chromium (Cr), sputtering yield ranges li ntawm 0.6 mus rau 0.8 Cr atoms ib ion. Feem ntau, lub zog ion ntau dua ua rau muaj txiaj ntsig ntau dua sputtering. Yog li ntawd, ntau dua kev tsis ncaj ncees voltage accelerates tus nqi tshem tawm ntawm cov khoom ntawm workpiece nto.
Qhov tseem ceeb tsis zoo voltage txawv rau ntau yam ntaub ntawv:
Cov hlau ntshiab (Cr, Ti, thiab lwm yam)
50-100V: Kev tso tawm ib txwm
200–300 V: Ceeb toom re-sputtering pib
300-500 V: Deposition tus nqi zero
Tshaj 500 V: Net etching yuav tshwm sim
Cov hlau ntshiab yog qhov muaj feem cuam tshuam rau rov-sputtering.
Nitrides (TiN, CrN, thiab lwm yam)
Nitrides muaj zog tshuaj sib txuas, ua rau atoms nyuaj rau dislodge. Yog li, lawv qhov kev tsis txaus ntseeg tseem ceeb rau qhov tseem ceeb re-sputtering yog siab dua.
Hauv qab 200 V: ruaj khov li qub deposition
300-500 V: Kev txo qis hauv kev tso nyiaj
500-800 V: Mus txog qhov chaw tseem ceeb rau kev tshem tawm cov khoom siv
DLC (Diamond-zoo li Carbon)
DLC yog qhov tshwj xeeb. Ntau cov txheej txheem ta-C (tetrahedral amorphous carbon) cov txheej txheem siv kev sib tw ntawm -800 V mus txog -1500 V. Txawm li cas los xij, ua tsaug rau hom mem tes thiab nruab nrab nruab nrab ion zog, ruaj khov deposition tseem tuaj yeem khaws cia. Qhov hnyav rov qab sputtering tsuas yog tshwm sim ntawm qhov siab dua ion zog.
Vim Li Cas Nruab Nrab Re-Sputtering yog qhov zoo
Ntau tus neeg tuaj tshiab tau ua yuam kev suav hais tias re-sputtering yog qhov tsis zoo, uas yog qhov tsis raug.
Hauv PVD, substrate bias ib nrab tso siab rau me me re-sputtering los txhim kho cov txheej txheem zoo. Loosely khi atoms, weakly adhered hais thiab unstable microstructures yog nyiam sputtered tam sim ntawd. Tsuas yog kev sib koom ua ke, cov qauv ruaj khov tseem nyob. Cov txheej txheem zoo ib yam li sieving xuab zeb: xoob nplej raug tshem tawm, tawm hauv cov txheej txheem compact.
Yog li ntawd, kev tswj tus mob me me re-sputtering yog qhov tseem ceeb rau kev ua kom cov yeeb yaj kiab.
Teeb meem tshwm sim los ntawm ntau dhau Re-Sputtering
Teeb meem tshwm sim ib zaug re-sputtering yuav khaus heev:
Txo tus nqi deposition
Qhov no yog qhov kev soj ntsuam ncaj qha tshaj plaws. Txawm hais tias tsis hloov lub hom phiaj lub zog, zaj duab xis thickness tsim qeeb qeeb, vim tias cov khoom siv tshiab tso tawm tsis tu ncua.
Hloov nyob rau hauv alloy muaj pes tsawg leeg
Siv TiAlN ua piv txwv: txhuas yog yooj yim rau re-sputter dua titanium. Aluminium cov ntsiab lus hauv txheej maj mam txo qis, ua rau qhov kawg muaj pes tsawg leeg sib txawv ntawm lub hom phiaj tsim.
Kev cuam tshuam crystal qauv
Kev tsis ncaj ncees ntau dhau ua rau cov tsim siv lead ua lattice mus rau qhov tsis sib xws ion foob pob tawg. Cov txiaj ntsig muaj xws li kev ntxhov siab hauv lub cev, nce qhov tsis xws luag, kev puas tsuaj ntawm cov nplej, nkig coatings thiab txawm tias zaj duab xis tawg.
Tswv yim txoj kev los txiav txim qhov Optimal Bias Voltage nyob rau hauv ntau lawm
Kev sib tw voltage cheb yog tus qauv mus kom ze.
Khaws lub hom phiaj lub zog, qhov kub thiab txias, kev ua haujlwm siab thiab roj ntws tsis tu ncua; tsuas yog kho qhov tsis zoo voltage. Qhia tus nqi deposition, hardness, residual stress thiab txheej muaj pes tsawg leeg rau txhua yam mob.
Hauv feem ntau cov txiaj ntsig, txheej hardness nce tsis tu ncua thaum xub thawj. Tom qab ncav cuag ib qho taw tes, tus nqi tso nyiaj poob qis heev. Qhov kev hloov pauv no qhia qhov twg qhov rov qab rov qab sputtering hnyav pib.
Qhov pom kev tsis zoo voltage feem ntau yog teem me ntsis hauv qab no qhov pib. Nws muab cov txheej txheej siab ceev thaum zam dhau ntau dhau re-sputtering.
Ib qho Kev Tsis Txaus Siab
Ntau tus kws tshaj lij xav tias qhov kev sib tw siab dua qhov sib npaug ntawm cov txheej txheem ntau dua. Qhov no yog kev nkag siab yuam kev.
Substrate bias tuaj yeem ua piv txwv rau txoj kev cov menyuam: tsis txaus siab tsis tuaj yeem ua rau cov pavement; nruab nrab siab yields ib tug du, khoom nto; siab dhau heev lawm ua rau txoj kev nto sib nrug.
Cov ntsiab lus
Rov qab sputtering yog ib qho tshwm sim ntawm lub cev. Kev tsis ncaj ncees ntau dhau ua rau siab - lub zog ions rov qab -etched coatings twb tso lawm.
Nruab nrab re-sputtering ua kom yooj yim rau cov yeeb yaj kiab. Txawm li cas los xij, ntau dhau re-sputtering ua rau qeeb qeeb, kev sib xyaw ua ke, nce kev ntxhov siab thiab kev puas tsuaj ntawm cov qauv.
Bias voltage tsis yog superior ntawm tus nqi siab dua. Cov txheej txheem paub tab ua rau qhov sib npaug: txaus ion foob pob kom densify zaj duab xis, tsis muaj eroding lub deposited txheej.
